December 3, 2015 -
Freescale Semiconductor has released an ultra-thin version of the Kinetis K22 microcontroller (MCU) designed for applications such as chip-and-PIN credit cards, wearables and consumer electronics, where security and small form factors are imperative.
Measuring at 0.34 millimeters in height, the Kinetis K22 MCU integrates 120 MHz of performance and a range of memories and interfaces.
Freescale plans to deploy this ultra-thin packaging technology across a wide range of its Kinetis MCU portfolio, with numerous products planned for release in the coming months.
By significantly reducing the device’s Z-axis, Freescale’s ultra-thin package meets the high demand for smaller form factors, more innovative design options and seamless integration.
“In the IoT era, an incessant demand for ’what’s next’ is challenging systems designers to consistently deliver breakthrough solutions,” said Steve Tateosian, manager of microcontroller platforms for Freescale. “Freescale’s new Kinetis package – measuring as thin as a blade of grass – demonstrates our commitment to advancing the consumer electronics, IoT and secure payments markets by enabling manufacturers to focus on their most taxing design challenges, while pushing the boundaries of functionality and integration.”
The significantly smaller size and height of the MCU provides systems designers with many opportunities, including new use cases for innovative applications.
Freescale has long been a major player in the IoT and smart device markets, and earlier this year, released the world’s smallest single chip module (SCM) for the IoT. The SCM effectively replaces a six-inch board with a device the size of a dime and reduces the need for 100-plus components down to just one.
The company also released the Kinetis KL03 MCU — the world’s smallest and most energy efficient ARM-based 32-bit MCU – which fits into the dimple of a golf ball.
Freescale’s ultra-thin package Kinetis K22 MCU can now be ordered with the part number MK22FN512CBP12R.