Fingerprint Cards working with NXP on biometric payment card technology

Fingerprint Cards announced that it is working with NXP Semiconductors on its new high performing contactless, biometric payment cards. NXP’s secure fingerprint authentication solution for cards does not require a battery and easily fits into standard card maker equipment as part of the broader payment ecosystem. Cards with fingerprint authentication are fully compliant with existing EMVCo POS systems. “We chose Fingerprints’ sensor technology as they are a leader in fingerprint sensors with market proven leading edge performance in power consumption

NXP releases thinnest contactless chip module for passport and ID cards

NXP Semiconductors N.V. released its new, ultra-thin contactless chip module that significantly improves the design flexibility of passport and identity cards. At only 200 μm thick ­– which is approximately four times the thickness of an average human hair – the MOB10 is 20 percent thinner than its predecessor, making it ideally suited for use in ultra-thin inlays for passport data pages and identity cards. The MOB10 is currently the thinnest contactless module available in high volumes and supports polycarbonate

NXP enhances fingerprint reader security with Precise Biometrics’ software

Precise Biometrics and NXP Semiconductors have signed a framework agreement covering Precise Biometrics fingerprint software. NXP will enhance its fingerprint reader security by integrating Precise Biometrics’ BioMatch fingerprint recognition software. The first business agreement under the framework agreement covers licensing of fingerprint software for embedding into NXP´s fingerprint reader products. The business agreement includes a per unit license fee, a fee for support and maintenance and a fee for non-recurring engineering efforts. Initial revenues generated under the agreement will be

NXP details top three global trends in biometric passports

NXP Semiconductors has identified its top three trends in electronic passports (ePassports or biometric passports) as increasing functionality, stronger security, and the ePassport complemented by ‘virtual mobile identity’. Seven hundred thirty million out of 900 million passports issued are ePassports, with 120 countries claiming that they are currently issuing ePassports, according to the International Civil Aviation Organization (ICAO). NXP explains how ePassport functionality is continuously evolving, with ICAO initially introducing BAC (Basic Access Control), then EAC (Extended Access Control), and

HID Global and NXP partner on turnkey solution using wearables for access control

HID Global Seos credential technology will be embedded in NXP Semiconductors SmartMX-based secure element devices to enable the use of wearable devices to open electronic locks at commercial buildings, hotels and workplaces. NXP and HID Global are also cooperating on a broad range of opportunities to expand the adoption of secure access to more applications and use cases. According to a statement by the company, wearables manufacturers worldwide with the Seos-ready NXP chips can enable building and parking access, PC