VIA, NEXT, and B-Secur share new biometric products at Embedded World 2018
VIA Technologies, NEXT Biometrics, and B-Secur are among several companies are sharing new developments in biometrics for electronic systems and IoT devices at Embedded World 2018 from February 27 to March 1 in Nuremberg, Germany.
VIA Technologies introduces Smart Recognition Platform
Via Technologies is debuting its Smart Recognition Platform for high performance object and facial recognition systems at Embedded World 2018.
The VIA Smart Recognition Platform is based on the VIA SOM-9X20 system module, powered by a Qualcomm Snapdragon 820 quad-core processor and including various options for camera and display integration, I/O enablement, and wireless connectivity. The platform has an advanced AI algorithm for object and facial recognition, according to the announcement, and is designed for flexible and scalable deployment in security, surveillance, traffic monitoring, building management, and consumer engagement applications.
“Computer vision technologies such as facial and object recognition are becoming a vital tool for boosting public safety and convenience everywhere from check-in counters and security screening in airports to self-service kiosks and payment authentication systems in supermarkets,” said Richard Brown, VP international marketing, VIA Technologies Inc. “The VIA Smart Recognition Platform speeds up the development and deployment of tailor-made systems that harness these cutting-edge technologies to deliver innovative new customer services and experiences.”
NEXT Biometrics previews development kit
NEXT Biometrics is joining Arrow Electronics at its Embedded World 2018 booth to share its new fingerprint sensor development kit based on the Qualcomm DragonBoard 410C.
The NEXT development kit enables developers to create complete biometric solutions with accurate fingerprint template extraction and fast matching capabilities, the company says.
“Joining forces with Arrow as one of the key players using the powerful Qualcomm DragonBoard highlights the strengths of our fingerprint sensor technology and is an important advantage for NEXT as we work with our customers to develop ever more powerful, secure and successful products,” says NEXT Senior Vice President of Sales Radek Matyasek.
The development board includes modules and readers featuring NEXT’s large sensor technology, and initial versions for both SPI and USB interfaces have been created. The development kit is expected to be available for purchase in March, and is suited to the development of systems for access control and IoT applications, according to the announcement.
B-Secur integrates heartbeat authentication with NXP chip
B-Secur has partnered with NXP Semiconductors to develop a new microcontroller chip for protecting connected devices, which is launching at Embedded World 2018. The chip is secured with integrated ECG authentication technology from B-Secur to protect consumer IoT devices.
“The key to this partnership is the integrating of our technology into NXP’s hardware. I am passionate about helping organisations understand that tapping into the power of next generation biometric authentication doesn’t require wholesale infrastructural change – it can be done flexibly with embedded solutions,” says B-Secur CEO Alan Foreman.
The companies say the product is the first single-chip device with a dual core architecture and embedded multi-protocol radio, which gives IoT developers a single supplier for silicon, software, enablement, support, and procurement. Heartbeat pattern analysis is inherently more accurate and secure than other biometrics, according to B-Secur, and also enables insight into performance factors like fitness, stress, fatigue.