Infineon reference design for Qualcomm Snapdragon 865 to ease mobile 3D facial biometric payments
Infineon Technologies and Qualcomm have jointly developed a 3D authentication reference design for the Qualcomm Snapdragon 865 Mobile Platform to bring its 3D sensor technology for applications including facial biometric payments to more mobile devices. The reference design enables standardized, cost-effective and easily designed integration, according to Infineon.
The REAL3 3D Time-of-Flight (ToF) sensor is a product of Infineon’s collaboration with pmdtechnologies. Infineon introduced a 4.4 mm x 5.1 mm 3D image sensor with VGA resolution at CES 2020, and says its technology meets the highest requirements for facial authentication, enhanced photo features, and augmented reality.
“Today, the smartphone is more than just an information medium; it is increasingly taking over security and entertainment functions,” says Andreas Urschitz, Division President for Power Management & Multimarket at Infineon. “3D sensors enable new uses and additional applications such as secured authentication or payment by facial recognition. We continue to focus on this market and have clear growth targets. The collaboration with Qualcomm Technologies on reference designs using REAL3 image sensors underscores the potential and our ambitions in this area.”
Infineon says it has been offering its 3D ToF technology for the mobile device market for four years.
LG flagship G8 ThinQ features 3D facial recognition powered by REAL3. Infineon and pmdtechnologies also teamed up with Idemia for an end-to-end 3D facial recognition solution for smartphones last year.
The Sharp AQUOS R5G, slated for launch this month, will feature the Infineon REAL3 for what it calls the first video bokeh effect in a 5G-capable smartphone.