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Under-display camera for 3D face biometrics developed by Infineon, pmd, ArcSoft

Partners Infineon and pmdtechnologies have teamed up with ArcSoft to develop a turnkey under-display time-of-flight 3D imaging solution that could enable OEMs to…

 

Biometrics partnership extended to IoT by Ambarella, Lumentum, On Semiconductor

Ambarella, Lumentum and ON Semiconductor have launched two joint reference designs under a collaborative partnership to accelerate the implementation of…

 

SPIE Defense + Commercial Sensing

SPIE Defense + Commercial Sensing Online April 12 – 16, 2021 SPIE Defense + Commercial Sensing is the leading global…

 

LG Innotek and Microsoft partner up on 3D sensing smart camera project

LG Innotek and Microsoft have announced a new 3D sensing collaboration to integrate LG Innotek’s Time of Flight (ToF) cameras…

 

A pair of chip firms announce new depth and distance platform for face biometrics

An indirect time of flight platform for 3D imaging and facial recognition has been announced by Tower Semiconductor. The company…

 

Infineon, pmd expect new depth sensor will take flight with rest of 3D image sensor market

Infineon Technologies AG and pmd Technologies have teamed up to develop a new 3D depth sensor that will give smartphones and…

 

Digital imaging pioneer Eric Fossum says future sensors could revolutionize biometrics, and urges caution

Professor Eric Fossum is concerned about the double-edged sword that powerful technologies, like those behind biometrics, represent. Connecting with Fossum…

 

BrainChip, Magik Eye working on biometric gesture, object recognition, classification

BrainChip Holdings and Magik Eye are jointly developing a system for object detection, object classification and biometric gesture recognition that…

 

Can Sony bring Edge AI and software subscription together to advance biometric ID?

The COVID-19 pandemic has created an urgent need in the biometrics market for identification systems that can support evolving requirements…

 

Infineon reference design for Qualcomm Snapdragon 865 to ease mobile 3D facial biometric payments

Infineon Technologies and Qualcomm have jointly developed a 3D authentication reference design for the Qualcomm Snapdragon 865 Mobile Platform to…

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