Under-display camera for 3D face biometrics developed by Infineon, pmd, ArcSoft
Partners Infineon and pmdtechnologies have teamed up with ArcSoft to develop a turnkey under-display time-of-flight 3D imaging solution that could enable OEMs to…
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Partners Infineon and pmdtechnologies have teamed up with ArcSoft to develop a turnkey under-display time-of-flight 3D imaging solution that could enable OEMs to…
Ambarella, Lumentum and ON Semiconductor have launched two joint reference designs under a collaborative partnership to accelerate the implementation of…
SPIE Defense + Commercial Sensing Online April 12 – 16, 2021 SPIE Defense + Commercial Sensing is the leading global…
LG Innotek and Microsoft have announced a new 3D sensing collaboration to integrate LG Innotek’s Time of Flight (ToF) cameras…
An indirect time of flight platform for 3D imaging and facial recognition has been announced by Tower Semiconductor. The company…
Infineon Technologies AG and pmd Technologies have teamed up to develop a new 3D depth sensor that will give smartphones and…
Professor Eric Fossum is concerned about the double-edged sword that powerful technologies, like those behind biometrics, represent. Connecting with Fossum…
BrainChip Holdings and Magik Eye are jointly developing a system for object detection, object classification and biometric gesture recognition that…
The COVID-19 pandemic has created an urgent need in the biometrics market for identification systems that can support evolving requirements…
Infineon Technologies and Qualcomm have jointly developed a 3D authentication reference design for the Qualcomm Snapdragon 865 Mobile Platform to…