Face++ and ams partner for 3D facial recognition solutions

High-performance sensor solution company ams and Megvii’s Face++ have formed a co-operative partnership to accelerate the deployment of face recognition and other 3D optical sensing technologies by OEMs and system integrators.

Combined solutions from the companies use infrared light projectors to map surfaces, and enable 3D face recognition on smartphones, among other applications, according to the announcement. Face++ will co-ordinate efforts to optimize its technologies and ams 3D optical systems for each other, and the companies will provide co-ordinated technical support for product manufacturers.

“Consumers are excited by the opportunity to buy products that have valuable features such as user face recognition. Now, by linking our 3D sensing systems with Face++ technology, we are enabling manufacturers to add these popular features to their products quickly and smoothly. Together, ams and Face++ are showing that 3D sensing solutions are ready for the mainstream now in every market sector, from consumer to automotive, medical and industrial electronics,” says Ulrich Huewels, Executive Vice-President & General Manager for Optical Sensor Solutions at ams.

In October, ams formed a partnership with Qualcomm to jointly develop face recognition technology for Android smartphones based on IR illuminator modules from ams and mobile application processors from Qualcomm.

“Face++ software already offers better performance in popular functions such as user face recognition,” says Wu Wenhao, Senior Vice President of Face++. “The partnership with ams strengthens the appeal of our software even more, because it allows us to provide our customers with a complete and optimized hardware and software system. Manufacturers will benefit hugely from avoiding the development risk and time associated with 3D sensing software and hardware integration.”

Face++ and ams are demonstrating a jointly developed face recognition system based on active stereo vision, running software from Bellus3D on a Qualcomm Snapdragon processor, at CES from January 8 to 12 in Las Vegas.

Megvii also partnered with a pair of semiconductor companies in September to offer a 3D sensing reference design for Active Stereo Cameras.

Related Posts

Article Topics

 |   |   |   |   | 

Comments

Leave a Reply

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Most Read This Week

Featured Company

Biometrics Research

Biometrics White Papers

Biometrics Events

Explaining Biometrics