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Infineon demos 3D image depth sensors for biometric authentication at CES 2020

Categories Biometric R&D  |  Biometrics News  |  Trade Notes


Infineon is showcasing at CES 2020 its 3D depth sensors for biometric facial authentication and enhanced photo capabilities on smart devices, in partnership with software and 3D Time of Flight system specialist pmdtechnologies ag, the company announced.

In February 2019, Idemia, Infineon and pmdtechnologies partnered to offer smartphone makers and other OEMs an end-to-end 3D facial recognition solution for user authenticated device unlocking and mobile payments.

Infineon claims to have created the smallest and most powerful 3D image depth sensor. Dubbed REAL3, the single-chip solution is 4.4 x 5.1 mm in size and the fifth-generation time-of-flight deep sensor from Infineon which can be embedded in any device regardless of size. The chip delivers high resolution data and low power consumption. The 3D sensor facilitates gesture control, which makes human-machine interaction context-based and touchless.

“With the fifth generation of our REAL3 chip we are once again demonstrating our leading position in the field of 3D sensors,” says Andreas Urschitz, President of the Power Management and Multimarket Division at Infineon, which also includes sensor business. “It’s robust, reliable, powerful, energy efficient and at the same time decisively small. We see great growth potential for 3D sensors, since the range of applications in the areas of security, image use and context-based interaction with the devices will steadily increase.”

Infineon’s deep sensor time-of-flight technology sets up authentic 3D images of faces, hand details or objects that can be easily matched to the original. It is implemented in payment transactions conducted via facial recognition on smart devices. The deep sensor technology ensures a reliable and secure image, and return transmission, feature that also applied to phone unlocking with a 3D image. The sensor works in extreme lighting conditions such as strong sunlight or in the dark and comes with additional options for cameras with enhanced autofocus, bokeh effect for photo and video. Real-time full-3D mapping enables authentic augmented reality experiences to be presented.

The 3D image sensor chip was developed in Graz, Dresden and Siegen, with series production announced for the middle of 2020. Infineon Technologies also develops an optimized illumination driver.

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