Qualcomm, BOE to develop biometric fingerprint display products for mobile, 5G, XR and IoT
Qualcomm has entered a strategic partnership with BOE Technology Group to collaborate on display products featuring Qualcomm 3D Sonic ultrasonic fingerprint sensors to improve performances in mobile, 5G, XR and IoT devices, the company announced.
BOE’s OLED panels have been upgraded with Qualcomm 3D Sonic sensors for smartphone OEMs to leverage the security fingerprint solution to deliver unique products. The partnership delivers technology to streamline the supply chain, reduce the bill of materials (BoM) and other expenses.
“As a global leader in the semiconductor display industry, BOE has always adhered to the IoT strategy of ‘Ecosystem: Open and Connected,’ providing global users with excellent intelligent interface devices and solutions. BOE will start shipping flexible OLED panels with integrated Qualcomm 3D Sonic sensors during the second half of 2020,” said Wenbao Gao, BOE executive vice president and chief executive officer of display and sensor, in a prepared statement.
“Qualcomm Technologies continuously strives to improve our collaboration in China, and collaboration with BOE will be another example of the dedication and our long-term commitment to driving innovations in this vibrant ecosystem,” said Roawen Chen, senior vice president and chief operations officer, QCT, Qualcomm Technologies, Inc., in the statement. “Through this collaboration, we expect that OEMs will have more opportunities to design cutting-edge products that feature OLED displays made with the Qualcomm 3D Sonic fingerprint sensor technology.”
Starting with the second half of 2020, BOE Technology Group customers will have access to commercial devices with integrated displays that include Qualcomm 3D Sonic fingerprint sensors.
Qualcomm was recently included on Fast Company’s list of the Most Innovative Companies for 2020.